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Technology Offers ( Materials - Semiconductors )

Through Substrate Via (TSV) with Embedded Capacitor for 3D Packaging

The demand for on-chip capacitor goes increasingly higher for integrated circuits (ICs) with 3D packaging technologies, because...

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High Speed LED Semiconductor Process for Visible Light Communication

There have been huge initiatives in developing light emitting diodes (LEDs) for the next generation of visible light communication...

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