A company is seeking to develop a new epoxy solder paste, with improved performance compared to conventional solder, for feature size <100µm. This new epoxy solder paste is expected to be implemented in applications such as mini/micro-LED, advanced packages SiP, automotive.
While existing conventional solder paste technologies is being used in various applications today, they have limited performance in terms of drop test, die shear and adhesion. It gets more challenging when dealing with very small interconnect applications. For example, tin bismuth (SnBi) alloy has been widely used in low temperature reflow applications, but the brittleness is a concern for reliability.
The company is thus seeking potential partners to develop a novel epoxy solder paste, as a joint reinforcement paste, that can improve the performance of small feature size (<100µm) applications. The company is open to various modes of collaboration and would like to partner with technology owners that are open to develop their existing technologies based on their requirements.
The proposed epoxy solder paste solution should have improved performance over conventional solder, in terms of die shear, and be able to achieve the following requirements: