Microelectromechanical devices (MEMS) range from sensors and actuators to entire systems. All MEMs systems require suitable materials with enhanced properties. The characteristic properties of ceramics, such as high strength, corrosion and temperature resistance, make them highly suitable for MEMs applications. Thermal management is a common challenge to all electronic devices as it critically impacts the overall performance of each system.
Currently, ceramic injection moulding is commonly use to mass produce such precision ceramic components. But with additive manufacturing playing an important role in Industry 4.0, the 3D printing processes technology of ceramics is also potentially to grow. Therefore, development of and researching of an alternative approach of ceramic composite-alloy materials, that caters to the flexibility in design for manufacturing and prototyping preparation has been developed.
This approach is designed for the development of multiple-materials composite formulations, suitable for mass production via automatic additive manufacturing and its highlights include:
An example of potential application that has demonstrated is the design of interposers for use on LED interconnection. The interposer made with this technology can be effectively adopted for others industries. Especially those require high thermal conductivity and good dielectric constant, while at the same time staying resistant to the hostile working environment.
The integrated methodology is applicable to telecommunications, smartphone devices, microelectronic devices, EV-automotive, and power-substrate for transportation industries etc.
The use of stable ceramic materials to telecommunications sector has gained foothold and will continue to expand. The adoption of Electric Vehicles (EVs) on a global scale has also strengthened the demand for thermally reliable electronic components, such as substrates for power electronics. Ceramics have proven to be one of preferred choices of material to be deployed in such applications.