TECH OFFER

Ceramic Composite Materials for Additive Manufacturing

KEY INFORMATION

TECHNOLOGY CATEGORY:
Electronics - Interconnects
Manufacturing - Additive Manufacturing
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TECHNOLOGY READINESS LEVEL (TRL):
LOCATION:
Singapore
ID NUMBER:
TO174278

TECHNOLOGY OVERVIEW

Microelectromechanical devices (MEMS) range from sensors and actuators to entire systems. All MEMs systems require suitable materials with enhanced properties. The characteristic properties of ceramics, such as high strength, corrosion and temperature resistance, make them highly suitable for MEMs applications. Thermal management is a common challenge to all electronic devices as it critically impacts the overall performance of each system.

Currently, ceramic injection moulding is commonly use to mass produce such precision ceramic components. But with additive manufacturing playing an important role in Industry 4.0, the 3D printing processes technology of ceramics is also potentially to grow. Therefore, development of and researching of an alternative approach of ceramic composite-alloy materials, that caters to the flexibility in design for manufacturing and prototyping preparation has been developed.

TECHNOLOGY FEATURES & SPECIFICATIONS

This approach is designed for the development of multiple-materials composite formulations, suitable for mass production via automatic additive manufacturing and its highlights include:

  • Use of simple organic compounds as preferred binders to produce 3D green parts (ceramic pre-forms before sintering), replacing the traditional need to process the feedstock under elevated temperatures. Value-add of a single process within a well-defined pyrolysis thermal profile for multiple core materials. This means that functional components can be produced effectively within a relatively shorter process cycle.
  • Higher solid-loading factor of working feed-stock with a minimum volume-change, improving the productivity and the quality consistency of the components. Energy saving is a consequential benefit.

An example of potential application that has demonstrated is the design of interposers for use on LED interconnection. The interposer made with this technology can be effectively adopted for others industries. Especially those require high thermal conductivity and good dielectric constant, while at the same time staying resistant to the hostile working environment.

POTENTIAL APPLICATIONS

The integrated methodology is applicable to telecommunications, smartphone devices, microelectronic devices, EV-automotive, and power-substrate for transportation industries etc.

Market Trends & Opportunities

The use of stable ceramic materials to telecommunications sector has gained foothold and will continue to expand. The adoption of Electric Vehicles (EVs) on a global scale has also strengthened the demand for thermally reliable electronic components, such as substrates for power electronics. Ceramics have proven to be one of preferred choices of material to be deployed in such applications. 

Benefits

  • Flexibility in product design and fast prototyping using additive manufacturing process
  • Apply bimodal nanoparticles to produce functional 3D components 
  • Co-sintering pyrolysis in single sequential processing that would increase productivity
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