This technology offer is a low-cost, shutterless thermal imaging sensor with no self-heating, based on a unique, patented CMOS-compatible process; it is offered in an advanced proprietary Wafer Level Vacuum Package (WLVP). The sensor is capable of detecting long wave infrared (LWIR) light, and has smaller pixels than a conventional thermopile-based sensor. It is easy to calibrate and has low power consumption. As the sensor is CMOS process compatible, it is scalable to high volume production, resulting in low cost fabrication.
· IR Wavelength: 8 – 14 µm
· Array Size: 80 (H) x 62 (V)
· Detector Pitch: 45 µm (H) x 45 µm (V)
· Maximum Frame Rate: up to 30 FPS
· ADC Output: 14 bit
· NETD: 150mK
· Dead Detectors: Max 2%
· Operating Temperature: -20°C to 85°C
· Optimum Scene Temperature Range: -20°C to <150°C
· Max Scene Temperature Range: -40°C to <1000°C
· Interface: SPI
· Voltage: 3.3 V
· Power Consumption: 50 mW
· WLVP Die: 6.7mm x 7.2mm x 1.1mm
· Wire Bonding Pad: 90 µm pads, 200 µm pitch
This sensor is suitable for mass market consumer and commercial thermal imaging applications, e.g., in smartphones and low cost thermal cameras. It is also deployable in thermal imaging applications where power consumption is a key constraint, e.g., in edge-based internet of things (IoT) devices.
According to a MarketsAndMarkets report, the thermal imaging market was valued at USD2.72 billion in 2017 and is expected to reach USD4.04 billion by 2023, at a CAGR of 6.73% during the forecast period. Thermal imaging modules have been witnessing mass adoption due to their compactness, low cost, and flexibility to integrate with other devices such as drones, smartphones, and wearables, enabling them to penetrate in new application areas.
· Low Cost
· Low Power
· Small form factor and uncooled – easy to integrate
· Shutterless and easy to calibrate