The technology described herein is related to aproprietary atmospheric-pressure plasma electrical cleaning technology for non-destructive removal oftightly-boundcontaminants (includingthose difficult-to-remove metaland metal oxide thin films) from objects' surfaces. This non-contact surface cleaning method addresses issues that conventional methods (such as abrasive, laser, CO2 gas cluster, etc.) cannot solve. The technology provider iscapable of re-developing and customizing their plasma cleaning systems to address to the unique needs and requirements of their clients. This technology has been developed through the support of various industry partners, local institutions and government agency. The technology provider is seeking for the following forms of collaboration opportunities: Research and commercial collaboration Exploration of new applications Technology licensing
Main Features: Atmospheric-pressure plasma cleaning One step removal of dust, organic compounds, metal transferred and metal oxides Non-destructive approach Ultra-fast cleaning Integrated process control Customized plasma emitters for different applications Safe to operate (simple training & no license required) This non-contact surface cleaning method does address those issues that conventional methods (such as abrasive, laser, CO2 gas cluster, etc.) cannot solve. The technology provider iscapable of re-developing and customizing their plasma cleaning systems to address to the unique needs and requirements of their clients.
Cleaning of microelectronics devices: Wirebonders’ capillaries/wedges (to removemetallic contaminants from the surface of wedges for improving bonding quality) Probe card’s tips (to remove metal and metal oxides from the probe cards' tips for improving surface contact resistance) Test sockets’ pins Mold/die components Harddisk media
Breakthrough in cleaning technologies Reducing surface contact resistances Activate surface for further process Improving device lifetime Efficiency/productivity improvement Cost saving