Condition monitoring is important to realize self-diagnostic functionality for civil structures, vehicles and machinery arrangements. Using piezoelectricity is an alternative approach to strain sensing, which typically requires a fast resposne time whilst consuming low power or even having no external power source. Piezoelectric sensors are normally bonded or assembled on the surface of the object, however, such bonding is difficult to conform to curved surfaces and may thus affect the strain coupling.
MicroElectroMechanical Systems (MEMS) techniques have been applied to produce micro-piezoelectric accelerometers, with the aim of further miniaturization. Piezoelectric micro-cantilever and diaphragm structures have been conventionally used to produce miniaturized accelerometers. However, cantilever structures are brittle and often deform due to large residual stresses, while diaphragm structures are rigid and limitated in sensitivity at small sizes.
The present invention avoids these issue through the innovative method of forming the piezoelectric material as a layer, directly onto the object surface.
The present technology include:
Potential applications of this technology includes, but are not limited to the following:
Advantages of the invention include:
We are looking for interested industry partners: