Materials for Printed Electronics: Copper Inks
Copper based inks have been gaining interest as a potentially cheaper alternative for the conventional, market ready conductive silver inks. However, most of the current copper inks in the market have the tendency to oxidize under room conditions, leading to performance issues and thereby limiting their adoption. This technology presents a range of conductive materials, specifically copper inks, targeted at the flexible printed hybrid electronics sector. These functional materials are specifically designed to be printable, cured at low temperature and flexible, making them ideal for printed electronics. Furthermore, the inks have been formulated to be extremely stable under ambient conditions, providing several advantages over the existing state of the art.
Two variations of copper inks are available: copper complex ink, and copper particle ink. Current methods for for electroless plating applications are achieved using palladium seed which is very costly. Copper complex ink can form a good base for such applications where building of circuit or electrodes on 3D images are an issue, providing a good, cost-effective alternative solution for the manufacture of printed electronics.
The company is interested in seeking collaborators from overseas companies, in particular from Germany or France, to jointly participate in the following joint innovation opportunities:
Germany-Singapore SME Funding Programme (Submission before 7 Dec 2021)
Singapore-France Joint Innovation Project (Submission before 31 Dec 2021)